Taiwan Semiconductor Manufacturing Company (TSMC) has officially disclosed its long-term technology roadmap, targeting the commencement of trial production for sub-1nm semiconductor nodes by 2029. The announcement, made during a technical symposium on April 20, 2026, reinforces the company's trajectory toward the Angstrom era of chip manufacturing. This development follows the confirmed schedule for the mass production of the 1.4nm process, internally designated as A14, which is set to begin in 2028.
The transition to sub-1nm technology represents a significant engineering shift for the foundry. According to technical documents released by the company, the A14 process will utilize advanced nanosheet transistor architectures, building upon the foundations laid by the 2nm (N2) node scheduled for high-volume manufacturing in late 2025. TSMC executives confirmed that the A14 node will offer improved power efficiency and performance density compared to its predecessors, though specific percentage gains remain under internal validation.
To support the sub-1nm milestone, TSMC is coordinating with equipment suppliers, most notably ASML, to integrate High-Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) lithography systems. These machines, which cost approximately 350 million to 400 million dollars each, are essential for patterning the incredibly fine features required for nodes below 2nm. TSMC Senior Vice President of R&D, Y.J. Mii, stated that the company has secured early delivery slots for these next-generation tools to ensure the 2029 trial production timeline remains viable.
Infrastructure expansion is already underway to accommodate these advanced processes. The company is currently expanding its presence in the Hsinchu Science Park Baoshan site, which is designated as the primary hub for 2nm and 1.4nm production. Furthermore, TSMC has initiated preliminary site assessments for a new facility capable of housing the sub-1nm lines, with Kaohsiung and Taichung cited as potential locations for these future GigaFabs.
The roadmap arrives as global competition in the foundry sector intensifies. Intel has previously outlined its 14A process for 2026-2027, while Samsung Electronics has signaled its intent to reach the 1.4nm threshold by 2027. TSMC announcement clarifies its strategy to maintain a leadership position through a phased rollout: 2nm in 2025, 1.4nm in 2028, and the first sub-1nm prototypes in 2029.
In terms of capital expenditure, TSMC maintained its previous guidance for the current fiscal year but noted that the integration of High-NA EUV tools and the construction of specialized cleanrooms for sub-1nm production would require sustained investment levels. The company did not provide specific cost estimates for the sub-1nm project but emphasized that its research and development budget continues to grow in alignment with these technical goals.